The U.S. is preparing to impose new sanctions targeting 200 Chinese chipmakers and potentially restricting the export of High Bandwidth Memory (HBM). The move is intended to further hinder China’s semiconductor and AI advancements. Tom’s Hardware reports: The update sheds light on the Biden administration’s recent efforts to impose stricter regulations on chip manufacturers in China. The latest swarm of sanctions reportedly targets roughly 200 Chinese firms. US companies are prohibited from exporting select technologies or products to the targeted firms. The report suggests that the US Department of Commerce aims to push these new regulations before the Thanksgiving break – or November 28. Neither the Department of Commerce nor the Chamber of Commerce responded to Reuters’ request for comments.

Moreover, another wave of sanctions is set to follow in December – targeting the export of HBM (High Bandwidth Memory) – primarily to choke China’s advance in the AI domain. The impacts of these restrictions are materializing given that Huawei’s Kirin SoCs and Ascend AI accelerators will reportedly remain stuck at 7nm technology until 2026 as SMIC fails to procure cutting-edge Extreme Ultraviolet (EUV) machines from ASML.